Revestimento de superfície: Revestidos de Ni/Au
Tela de seda: Branco, Preto, Amarelo
Materiais: Ventec, Polytronics, Begquist
Espessura da placa: 0.2-6.0 mm
Espaço mínimo na linha: 8mil
Processamento: Reunião
Surface Mount Technology: Available
Vip Process: Yes
Thickness Of Copper: 0.5-14oz (18-490um)
Surface Finishing: HASL/OSP/ENIG
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Tamanho mínimo do painel: 50mm x 50mm
Superfície: Ouro de imersão
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Thickness Of Copper: 0.5-14oz (18-490um)
Pcb: Single,double,multilayer Pcb,custom Pcb
Min Trace: 3/3MIL
Espessura do PCB: 1.6 mm
Vias Cegas e Enterradas: Disponível
Espessura: 00,4-3,2 mm
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